- Manufacturer：
-
- JAE Electronics (7)
- TE Connectivity (3)
- Part Status：
-
- Packaging：
-
- Connector Type：
-
- Number of Positions：
-
- Contact Finish Thickness：
-
- Card Type：
-
- Mounting Feature：
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- Insertion, Removal Method：
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20 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
KYOCERA Corporation | MICROSIM CARD CO... |
2,573
In-stock
|
|||
|
|
KYOCERA Corporation | MICROSIM CARD CO... |
2,573
In-stock
|
|||
|
|
KYOCERA Corporation | MICROSIM CARD CO... |
1,500
In-stock
|
|||
|
|
Molex Corporation | NANO-SIM CARD CON... |
6,539
In-stock
|
|||
|
|
Molex Corporation | NANO-SIM CARD CON... |
6,539
In-stock
|
|||
|
|
Molex Corporation | NANO-SIM CARD CON... |
5,700
In-stock
|
|||
|
|
TE Connectivity | CONN MICRO SIM CA... |
13,369
In-stock
|
|||
|
|
TE Connectivity | CONN MICRO SIM CA... |
13,369
In-stock
|
|||
|
|
TE Connectivity | CONN MICRO SIM CA... |
13,050
In-stock
|
|||
|
|
JAE Electronics | CONN MICRO SIM CA... |
5,000
In-stock
|
|||
|
|
JAE Electronics | CONN MICRO SIM CA... |
5,000
In-stock
|
|||
|
|
JAE Electronics | CONN MICRO SIM CA... |
5,000
In-stock
|
|||
|
|
JAE Electronics | DUAL NANO SIM CAR... |
5,000
In-stock
|
|||
|
|
Molex Corporation | CONN SIM CARD PUS... |
5,000
In-stock
|
|||
|
|
JAE Electronics | COMBO MICRO SD/NA... |
1,102
In-stock
|
|||
|
|
JAE Electronics | COMBO MICRO SD/NA... |
1,102
In-stock
|
|||
|
|
JAE Electronics | COMBO MICRO SD/NA... |
5,000
In-stock
|
|||
|
|
Molex Corporation | CONN SIM CARD BLO... |
32,601
In-stock
|
|||
|
|
Molex Corporation | CONN SIM CARD BLO... |
32,601
In-stock
|
|||
|
|
Molex Corporation | CONN SIM CARD BLO... |
32,400
In-stock
|