- Manufacturer：
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- CUI Devices (1)
- Wakefield-Vette (4)
- Series：
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- Type：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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7 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK CPU W/AD... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU STA... |
5,273
In-stock
|
|||
|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
945
In-stock
|
|||
|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
120
In-stock
|
|||
|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
193
In-stock
|
|||
|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
900
In-stock
|