- Manufacturer：
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- CUI Devices (2)
- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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11 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CL... |
154
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CL... |
1,701
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220/TO... |
1,900
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CL... |
2,725
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220/TO... |
9,990
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CL... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
874
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
146
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-220 19X... |
915
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-220 19X... |
233
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-220 19X... |
12,316
In-stock
|