- Part Status:
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- Material:
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- Package Cooled:
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- Attachment Method:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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7 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK BLACK A... |
5,000
In-stock
|
|||
|
DFRobot | RASPBERRY PI PUR... |
132
In-stock
|
|||
|
Assmann WSW Components | HEATSINK ALUM AN... |
579
In-stock
|
|||
|
t-Global Technology | CERAMIC HEATSINK |
7
In-stock
|
|||
|
t-Global Technology | HEATSINK CER 12X12... |
517
In-stock
|
|||
|
Assmann WSW Components | HEATSINK CPU XCU... |
3,447
In-stock
|
|||
|
t-Global Technology | HEATSINK CER 12X12... |
2,873
In-stock
|
