- Manufacturer：
-
- Aavid (25)
- Comair Rotron (3)
- CUI Devices (8)
- Ohmite (3)
- Wakefield-Vette (6)
- Series：
-
- Part Status：
-
- Material：
-
- Width：
-
- Package Cooled：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
55 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK TO-220 VE... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK TO-220 VE... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Ohmite | HEATSINK FOR TO-2... |
86
In-stock
|
|||
|
|
t-Global Technology | PH3N NANO 50.8X12.07X... |
129
In-stock
|
|||
|
|
Ohmite | HEATSINK TO-218,TO... |
725
In-stock
|
|||
|
|
Aavid | HEATSINK TO-220 W/T... |
5,695
In-stock
|
|||
|
|
Aavid | HEATSINK TO-220 SO... |
1,120
In-stock
|