- Part Status：
-
- Material：
-
- Packaging：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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10 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Ohmite | TO-268 SMD HEAT SIN... |
5,000
In-stock
|
|||
|
|
Ohmite | HEATSINK FOR TO-2... |
1
In-stock
|
|||
|
|
Ohmite | HEATSINK FOR TO-2... |
1
In-stock
|
|||
|
|
Ohmite | TO-268 HEAT SINK /P... |
5,000
In-stock
|
|||
|
|
Ohmite | TO-268 SMD HEAT SIN... |
5,000
In-stock
|
|||
|
|
Ohmite | TO-268 HEAT SINK /P... |
5,000
In-stock
|
|||
|
|
Aavid | HEATSINK D-PAK3 T... |
5,612
In-stock
|
|||
|
|
Aavid | HEATSINK D-PAK3 T... |
5,612
In-stock
|
|||
|
|
Aavid | HEATSINK D-PAK3 T... |
5,500
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
6,677
In-stock
|