- Manufacturer：
-
- CUI Devices (1)
- Wakefield-Vette (3)
- Material：
-
- Type：
-
- Package Cooled：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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9 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ANOD AL... |
583
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK 29X12MM S... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK 29X12MM D... |
97
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK 29X12MM F... |
97
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
216
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
151
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
420
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ANOD AL... |
296
In-stock
|