- Manufacturer：
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- CUI Devices (5)
- Wakefield-Vette (1)
- Series：
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- Material：
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- Length：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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12 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK 35MMX35MM... |
10
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | ALUM HEAT SINK MA... |
194
In-stock
|
|||
|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
193
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
231
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 35MM X 35... |
1
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
464
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 35MM X 35... |
387
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
293
In-stock
|