- Manufacturer:
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- CUI Devices (1)
- Package Cooled:
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- Attachment Method:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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5 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK ALUM AN... |
173
In-stock
|
|||
|
Assmann WSW Components | HEATSINK ALUM AN... |
188
In-stock
|
|||
|
Assmann WSW Components | HEATSINK ALUM AN... |
148
In-stock
|
|||
|
CUI Devices | HEATSINK TO-220 2.9W... |
358
In-stock
|
|||
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
1,362
In-stock
|
