- Manufacturer:
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- CUI Devices (1)
- Package Cooled:
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- Attachment Method:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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2 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 2.9W... |
5,048
In-stock
|
|||
|
Adafruit Industries | MINI ALUMINUM HE... |
336
In-stock
|
