- Manufacturer：
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- Aavid (38)
- CUI Devices (5)
- DFRobot (2)
- Seeed (2)
- t-Global Technology (23)
- Wakefield-Vette (13)
- Series：
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- Packaging：
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- Type：
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- Shape：
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- Length：
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- Width：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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111 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Aavid | COPPER HEATSINK ... |
5,000
In-stock
|
|||
|
|
Aavid | COPPER HEATSINK ... |
5,000
In-stock
|
|||
|
|
Aavid | COPPER HEATSINK ... |
5,000
In-stock
|
|||
|
|
Aavid | COPPER HEATSINK ... |
5,000
In-stock
|
|||
|
|
Aavid | COPPER HEATSINK ... |
5,000
In-stock
|
|||
|
|
t-Global Technology | IR HEAT SPREADER... |
5,000
In-stock
|
|||
|
|
t-Global Technology | PH3 222X165X0.21MM W/A... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CO... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
t-Global Technology | PH3N 100X100X0.07MM W/... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
t-Global Technology | PH3N NANO 76.2X25.4X0... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK ALUM NA... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK ALUM BL... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK TO-252 CO... |
5,000
In-stock
|