- Manufacturer：
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- ABB Embedded Power (15)
- Comair Rotron (49)
- CUI Devices (2)
- Ohmite (7)
- Panasonic (2)
- Seeed (1)
- Sunon (3)
- TE Connectivity (48)
- Wakefield-Vette (30)
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- Material：
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- Package Cooled：
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- Attachment Method：
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- Thermal Resistance @ Natural：
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285 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CTS Electronic Components | HEATSINK PRESS O... |
5,000
In-stock
|
|||
|
|
Ohmite | CERAMIC HEATSINK... |
30
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK TO-220 VE... |
487
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 10... |
924
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 10... |
356
In-stock
|