- Manufacturer：
-
- ABB Embedded Power (15)
- Comair Rotron (49)
- CUI Devices (2)
- Ohmite (7)
- Panasonic (2)
- Seeed (1)
- Sunon (3)
- TE Connectivity (48)
- Wakefield-Vette (30)
- Series：
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- Material：
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- Shape：
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- Length：
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- Width：
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- Diameter：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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285 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 24... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 25... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 12... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 19... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 25... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 24... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 36... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK EXTRUDE... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK EXTRUDE... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 13... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK EXTRUDE... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK EXTRUD ... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
Sunon | FAN CPU COOLER 98X... |
5,000
In-stock
|