- Manufacturer：
-
- Aavid (2)
- CUI Devices (2)
- Ohmite (1)
- Material：
-
- Package Cooled：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
6 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
Ohmite | HEATSINK FOR TO-2... |
86
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
188
In-stock
|
|||
|
|
Aavid | HEATSINK TO-220 SO... |
1,120
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
736
In-stock
|
|||
|
|
Aavid | HEATSINK TO-220 PO... |
2,485
In-stock
|