- Manufacturer：
-
- Comair Rotron (1)
- CUI Devices (1)
- Wakefield-Vette (2)
- Series：
-
- Part Status：
-
- Width：
-
- Package Cooled：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
-
7 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 22... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK ALUM NA... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK ALUM BL... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK TO-252 CO... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-252 D-P... |
559
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TRIPLE ... |
1,349
In-stock
|
|||
|
|
Apex Microtechnology | HEATSINK SMT |
86
In-stock
|