- Manufacturer：
-
- Aavid (1)
- CUI Devices (58)
- Ohmite (30)
- TE Connectivity (1)
- Wakefield-Vette (57)
- Series：
-
- Type：
-
- Shape：
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- Length：
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- Width：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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413 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
293
In-stock
|
|||
|
|
Aavid | 61085 EXTRUSION 1.312... |
6
In-stock
|
|||
|
|
Ohmite | ALUMINUM EXTRUSI... |
12
In-stock
|
|||
|
|
Ohmite | ALUMINUM EXTRUSI... |
14
In-stock
|
|||
|
|
Ohmite | ALUMINUM EXTRUSI... |
15
In-stock
|
|||
|
|
Ohmite | ALUMINUM EXTRUSI... |
10
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,442
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU XCU... |
1,066
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU XCU... |
2,663
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU XCU... |
3,447
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU XCU... |
2,863
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU XCU... |
1,302
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU XCU... |
6,838
In-stock
|