- Shape:
-
- Package Cooled:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
13 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
![]() |
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
![]() |
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
![]() |
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
![]() |
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
![]() |
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
![]() |
Seeed | HEAT SINK KIT FOR... |
4
In-stock
|
|||
![]() |
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
![]() |
Seeed | HEAT SINK KIT FOR... |
31
In-stock
|
|||
![]() |
OSEPP Electronics Limited | RASPBERRY PI TAL... |
200
In-stock
|
|||
![]() |
OSEPP Electronics Limited | RASPBERRY PI LOW... |
200
In-stock
|
|||
![]() |
Seeed | HEAT SINK KIT FOR... |
70
In-stock
|
|||
![]() |
Seeed | HEAT SINK KIT FOR... |
1,048
In-stock
|