- Manufacturer：
-
- Aavid (8)
- Comair Rotron (3)
- CUI Devices (4)
- Ohmite (18)
- Wakefield-Vette (8)
- Part Status：
-
- Material：
-
- Width：
-
- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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50 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Wakefield-Vette | TO-263 HEAT SINK AN... |
1,251
In-stock
|
|||
|
|
Wakefield-Vette | TO-263 HEAT SINK AN... |
1,251
In-stock
|
|||
|
|
Wakefield-Vette | TO-263 HEAT SINK AN... |
1,250
In-stock
|
|||
|
|
Ohmite | HEATSINK FOR TO-2... |
2,697
In-stock
|
|||
|
|
Ohmite | HEATSINK FOR TO-2... |
2,697
In-stock
|
|||
|
|
Ohmite | HEATSINK FOR TO-2... |
2,600
In-stock
|
|||
|
|
Wakefield-Vette | TO-263 HEAT SINK AN... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | TO-263 HEAT SINK AN... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | TO-263 HEAT SINK AN... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | TO-263 HEAT SINK AN... |
92
In-stock
|
|||
|
|
Wakefield-Vette | TO-263 HEAT SINK AN... |
569
In-stock
|
|||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
879
In-stock
|
|||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
879
In-stock
|
|||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
750
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-263 19.3... |
393
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
2,660
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
3,432
In-stock
|
|||
|
|
Ohmite | TO-263 HEAT SINK / P... |
1,476
In-stock
|
|||
|
|
Ohmite | TO-263 HEAT SINK / P... |
1,476
In-stock
|
|||
|
|
Ohmite | TO-263 HEAT SINK / P... |
1,250
In-stock
|