- Manufacturer:
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- CUI Devices (2)
- Length:
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- Width:
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- Attachment Method:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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9 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 4.4W... |
5,000
In-stock
|
|||
|
CUI Devices | HEATSINK TO-220 3.6W... |
5,000
In-stock
|
|||
|
Assmann WSW Components | HEATSINK ALUM AN... |
37
In-stock
|
|||
|
Assmann WSW Components | HEATSINK ANOD AL... |
583
In-stock
|
|||
|
Assmann WSW Components | HEATSINK ALUM AN... |
15
In-stock
|
|||
|
Assmann WSW Components | HEATSINK ALUM AN... |
114
In-stock
|
|||
|
Assmann WSW Components | HEATSINK ALUM AN... |
179
In-stock
|
|||
|
Assmann WSW Components | HEATSINK ALUM AN... |
134
In-stock
|
|||
|
Assmann WSW Components | HEATSINK ALUM AN... |
3,412
In-stock
|
