- Manufacturer：
-
- CUI Devices (5)
- Seeed (1)
- Packaging：
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- Shape：
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- Width：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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11 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK TO-263 CO... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK TO-252 CO... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
219
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
219
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-252 D-P... |
559
In-stock
|
|||
|
|
Seeed | RASPERRY PI COPP... |
199
In-stock
|
|||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
879
In-stock
|
|||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
879
In-stock
|
|||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
750
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
2,660
In-stock
|