- Manufacturer：
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- Comair Rotron (3)
- CUI Devices (1)
- Part Status：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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8 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK ALUM AN... |
5,000
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 10... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 10... |
924
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 10... |
356
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CL... |
1,650
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 |
1,913
In-stock
|