- Manufacturer：
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- CUI Devices (9)
- Wakefield-Vette (3)
- Series：
-
- Material：
-
- Length：
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- Width：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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110 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK 33X33X12.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 32.5X32.5X1... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 31X31X12.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 17X17X12.5M... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 32.5 X 32.5... |
98
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X12.5M... |
84
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 57.5 X 57.5... |
96
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 31MM X 31... |
35
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-220/TO... |
104
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
188
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
324
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 45MM X 45... |
538
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 42.5 X 42.5... |
1,493
In-stock
|