- Manufacturer：
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- CUI Devices (9)
- Wakefield-Vette (3)
- Series：
-
- Material：
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- Length：
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- Width：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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110 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 37.5 X 37.5... |
625
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
979
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK T766 |
687
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | MAXIGRIP HS ASSY... |
1,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 42.5 X 42.5... |
1,274
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 33MM X 33... |
731
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 31MM X 31... |
684
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 30MM X 30... |
410
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23... |
640
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | ALUM HEAT SINK MA... |
194
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1,827
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1,883
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1,735
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 33MM X 33... |
105
In-stock
|
|||
|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
315
In-stock
|
|||
|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
193
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
231
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 37.5 X 37.5... |
1,324
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19... |
580
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 57.5 X 57.5... |
4
In-stock
|