- Manufacturer:
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- CUI Devices (2)
- Package Cooled:
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- Attachment Method:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 5.1W... |
2,973
In-stock
|
|||
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X... |
7
In-stock
|
|||
|
CUI Devices | HEATSINK TO-220 5.1W... |
696
In-stock
|
