- Manufacturer：
-
- Wakefield-Vette (2)
- Type：
-
- Package Cooled：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-3 BLA... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
5,000
In-stock
|