- Manufacturer：
-
- Aavid (3)
- DFRobot (2)
- Seeed (2)
- t-Global Technology (23)
- Packaging：
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- Type：
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- Length：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Natural：
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- Material Finish：
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46 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
t-Global Technology | IR HEAT SPREADER... |
5,000
In-stock
|
|||
|
|
t-Global Technology | PH3 222X165X0.21MM W/A... |
5,000
In-stock
|
|||
|
|
t-Global Technology | PH3N 100X100X0.07MM W/... |
5,000
In-stock
|
|||
|
|
t-Global Technology | PH3N NANO 76.2X25.4X0... |
5,000
In-stock
|
|||
|
|
t-Global Technology | PH3N NANO 76.2X12.07X... |
5,000
In-stock
|
|||
|
|
OSEPP Electronics Limited | RASPBERRY PI COP... |
200
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
287
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
287
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
287
In-stock
|
|||
|
|
DFRobot | RASPBERRY PI PUR... |
132
In-stock
|
|||
|
|
t-Global Technology | PH3N NANO 50.8X12.07X... |
129
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | QUADFLOW HEATSIN... |
24
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | DUALFLOW HEATSIN... |
24
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | QUADFLOW HEATSIN... |
25
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | DUALFLOW HEATSIN... |
25
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | CPU HEAT SINK NO ... |
25
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | CPU HEAT SINK NO ... |
25
In-stock
|
|||
|
|
Aavid | INTEL XEON CPU CO... |
18
In-stock
|
|||
|
|
Aavid | THM,10594B-TT REV BB... |
1,806
In-stock
|
|||
|
|
Seeed | RASPERRY PI COPP... |
199
In-stock
|