- Part Status：
-
- Material：
-
- Package Cooled：
-
- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
-
- Filter：
394 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
TE Connectivity | HTS511=1.8X1.8X.3 HEAT... |
5,000
In-stock
|
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|
|
TE Connectivity | HTS775-2=HS PLTD |
5,000
In-stock
|
|||
|
|
TE Connectivity | HTS697-2=CLR IRIDIT... |
5,000
In-stock
|
|||
|
|
TE Connectivity | 3 FINS, 1.375 OD HS W... |
5,000
In-stock
|
|||
|
|
TE Connectivity | 3 FINS, 1.375 OD HS W... |
5,000
In-stock
|
|||
|
|
TE Connectivity | 3 FINS, 1.375 OD HS W... |
5,000
In-stock
|
|||
|
|
TE Connectivity | CHIPSET HEATSINK... |
5,000
In-stock
|
|||
|
|
TE Connectivity | 21MM HEATSINK ASS... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HTS113-1=HS PLTD |
5,000
In-stock
|
|||
|
|
TE Connectivity | 21MM HS ASSY ULTEM... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HTS743-2=HS PLTD |
5,000
In-stock
|
|||
|
|
TE Connectivity | HTS523-3=HS PLTD CL... |
5,000
In-stock
|
|||
|
|
TE Connectivity | QSFP SINGLE PCI E... |
5,000
In-stock
|
|||
|
|
TE Connectivity | GANGED QSFP SAN E... |
5,000
In-stock
|
|||
|
|
TE Connectivity | RETENTION MODULE... |
5,000
In-stock
|
|||
|
|
TE Connectivity | QSFP SINGLE SAN E... |
5,000
In-stock
|
|||
|
|
TE Connectivity | H SINK/CLIP ASSEM... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HTS795-1=HS UPLTD |
5,000
In-stock
|
|||
|
|
TE Connectivity | H SINK/CLIP ASSEM... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HTS781-2=HS PLTD |
5,000
In-stock
|