- Part Status：
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- Material：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Filter：
394 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
TE Connectivity | HTS732-2=HS PLTD |
5,000
In-stock
|
|||
|
|
TE Connectivity | HTS519-2U=25MM MTG C... |
5,000
In-stock
|
|||
|
|
TE Connectivity | 25MM HS ASSY ULTEM... |
5,000
In-stock
|
|||
|
|
TE Connectivity | GANGED QSFP LAN E... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK |
123
In-stock
|
|||
|
|
TE Connectivity | HEATSINK ASSEMBL... |
25
In-stock
|
|||
|
|
TE Connectivity | HEATSINK ASSEMBL... |
19
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 25MM... |
250
In-stock
|
|||
|
|
TE Connectivity | HTS389-P=HS ASSY PP... |
250
In-stock
|
|||
|
|
TE Connectivity | HTS665-2=HS PLTD |
144
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 25MM... |
279
In-stock
|
|||
|
|
TE Connectivity | HEATSINK CFP RID... |
262
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 37.5M... |
8
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 21MM... |
22
In-stock
|