- Manufacturer：
-
- CUI Devices (13)
- Parker Chomerics (1)
- t-Global Technology (61)
- Part Status：
-
- Type：
-
- Shape：
-
- Thickness：
-
- Thermal Conductivity：
-
- Outline：
-
- Backing, Carrier：
-
- Thermal Resistivity：
-
90 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Laird Thermal Materials | TFLEX SF8120 |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX SF8110 |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX SF8100 |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX SF890 |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX SF880 |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 320MMX320... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX SF870 |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 20MMX20M... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 100MMX100... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 100MMX100... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX SF860 |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX SF850 |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 320MMX320... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX SF840 |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX SF830 |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 20MMX10M... |
5,000
In-stock
|