- Manufacturer：
-
- Bergquist / Henkel (13)
- CUI Devices (52)
- Leader Tech Inc. (10)
- Parker Chomerics (31)
- t-Global Technology (78)
- Taica Corporation (16)
- Series：
-
- Material：
-
- Type：
-
- Thickness：
-
- Thermal Conductivity：
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- Outline：
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- Backing, Carrier：
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- Thermal Resistivity：
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274 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Laird Thermal Materials | THERM PAD 406.4MMX4... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 406.4MMX4... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 228.6MMX2... |
1
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 457.2MMX4... |
1
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 406.4MMX4... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 228.6MMX2... |
1
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 406.4MMX4... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 406.4MMX4... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 228.6MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 228.6MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 406.4MMX4... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TPLI220 6W/MK GP FI... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 406.4MMX4... |
5,000
In-stock
|
|||
|
|
Bergquist / Henkel | THERM PAD 406.4MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | GAP FILLER TPLI 2... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|