- Manufacturer：
-
- 3M (32)
- CUI Devices (28)
- Laird Thermal Materials (465)
- Leader Tech Inc. (20)
- Panasonic (9)
- Parker Chomerics (14)
- t-Global Technology (333)
- Taica Corporation (34)
- Wakefield-Vette (11)
- Series：
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- Part Status：
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- Material：
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- Type：
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- Thickness：
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- Usage：
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- Adhesive：
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- Thermal Conductivity：
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- Outline：
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- Backing, Carrier：
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949 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Laird Thermal Materials | THERM PAD 228.6MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 228.6MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 203.2MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX HD93000,DC1 |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 203.2MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 457.2MMX4... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX SF8120 |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 228.6MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 203.2MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 228.6MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 203.2MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX HD92750,DC1 |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX SF8110 |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 228.6MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 457.2MMX4... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 203.2MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 228.6MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 203.2MMX2... |
5,000
In-stock
|