- Manufacturer:
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- 3M (8)
- Bergquist / Henkel (14)
- CUI Devices (26)
- Laird Thermal Materials (226)
- Leader Tech Inc. (10)
- Parker Chomerics (10)
- Wakefield-Vette (12)
- Series:
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- Part Status:
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- Material:
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- Color:
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- Type:
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- Shape:
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- Thickness:
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- Usage:
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- Outline:
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- Backing, Carrier:
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- Thermal Resistivity:
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312 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
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Laird Thermal Materials | TFLEX P330 9.00X9.00IN |
14
In-stock
|
|||
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CUI Devices | THERM PAD 30MMX30M... |
17
In-stock
|
|||
![]() |
CUI Devices | THERM PAD 15MMX15M... |
94
In-stock
|
|||
![]() |
CUI Devices | THERM PAD 41.25MMX4... |
7
In-stock
|
|||
![]() |
CUI Devices | THERM PAD 40MMX40M... |
41
In-stock
|
|||
![]() |
CUI Devices | THERM PAD 50MMX50M... |
20
In-stock
|
|||
![]() |
CUI Devices | THERM PAD 10MMX10M... |
11
In-stock
|
|||
![]() |
CUI Devices | THERM PAD 20MMX20M... |
14
In-stock
|
|||
![]() |
CUI Devices | THERM PAD 70MMX70M... |
7
In-stock
|
|||
![]() |
Parker Chomerics | THERM-A-GAP A579 9X... |
26
In-stock
|
|||
![]() |
Laird Thermal Materials | TFLEX UT20450 9" X 9" |
12
In-stock
|
|||
![]() |
Parker Chomerics | THERM-A-GAP A579 9X... |
33
In-stock
|
|||
![]() |
CUI Devices | THERM PAD 15MMX30M... |
17
In-stock
|
|||
![]() |
Laird Thermal Materials | TFLEX UT20375 9" X 9" |
6
In-stock
|
|||
![]() |
Laird Thermal Materials | TFLEX UT20250 9" X 9" |
27
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 228.6MMX2... |
5,000
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 228.6MMX2... |
5,000
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 228.6X228.6... |
26
In-stock
|
|||
![]() |
Wakefield-Vette | THERM PAD 101.6MMX1... |
145
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 457.2X457.2... |
30
In-stock
|