- Manufacturer：
-
- CUI Devices (13)
- Laird Thermal Materials (161)
- Leader Tech Inc. (5)
- Parker Chomerics (2)
- t-Global Technology (29)
- Wakefield-Vette (12)
- Series：
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- Part Status：
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- Material：
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- Type：
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- Shape：
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- Thickness：
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- Outline：
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- Backing, Carrier：
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- Thermal Resistivity：
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231 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
Leader Tech Inc. | THERM PAD 199.9MMX1... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 152MMX152... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 100MMX100... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 41.91MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 228.6MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 228.6MMX2... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 288MMX192... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 288MMX192... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 19.05MMX1... |
5,000
In-stock
|
|||
|
|
Bergquist / Henkel | THERM PAD 406.4MMX2... |
5,000
In-stock
|