32-6554-10
- Manufacturer
- Aries Electronics, Inc.
- Product Category
- Sockets for ICs, Transistors
- Description
- CONN IC DIP SOCKET ZIF 32POS TIN
- Manufacturer :
- Aries Electronics, Inc.
- Product Category :
- Sockets for ICs, Transistors
- Contact Finish - Mating :
- Tin
- Contact Finish - Post :
- Tin
- Contact Finish Thickness - Mating :
- 200.0µin (5.08µm)
- Contact Finish Thickness - Post :
- 200.0µin (5.08µm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Beryllium Copper
- Features :
- Closed Frame
- Housing Material :
- Polyphenylene Sulfide (PPS), Glass Filled
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 32 (2 x 16)
- Operating Temperature :
- -
- Packaging :
- Bulk
- Part Status :
- Active
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Series :
- 55
- Termination :
- Solder
- Type :
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Datasheet :
- 32-6554-10
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