300-PLS20006-12

Manufacturer
Aries Electronics, Inc.
Product Category
Sockets for ICs, Transistors
Description
CONN SOCKET PGA ZIF GOLD
Manufacturer :
Aries Electronics, Inc.
Product Category :
Sockets for ICs, Transistors
Contact Finish - Mating :
Gold
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
30.0µin (0.76µm)
Contact Finish Thickness - Post :
200.0µin (5.08µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Beryllium Copper
Features :
Closed Frame
Housing Material :
Polyphenylene Sulfide (PPS)
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
-
Operating Temperature :
-65°C ~ 125°C
Packaging :
Bulk
Part Status :
Active
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
PLS
Termination :
Solder
Type :
PGA, ZIF (ZIP)
Datasheet :
300-PLS20006-12

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