BDN18-6CB/A01

Manufacturer :

CTS Electronic Components

Product Category :

Thermal - Heat Sinks

Attachment Method :

Thermal Tape, Adhesive (Included)

Diameter :

-

Height Off Base (Height of Fin) :

0.605" (15.37mm)

Length :

1.810" (45.97mm)

Material :

Aluminum

Material Finish :

Black Anodized

Package Cooled :

Assorted (BGA, LGA, CPU, ASIC...)

Part Status :

Active

Power Dissipation @ Temperature Rise :

-

Series :

BDN

Shape :

Square, Pin Fins

Thermal Resistance @ Forced Air Flow :

2.80°C/W @ 400 LFM

Thermal Resistance @ Natural :

8.10°C/W

Type :

Top Mount

Width :

1.810" (45.97mm)