- Manufacturer：
-
- Aavid (38)
- Comair Rotron (8)
- CUI Devices (5)
- DFRobot (2)
- Seeed (2)
- t-Global Technology (23)
- Wakefield-Vette (14)
- Series：
-
- Part Status：
-
- Packaging：
-
- Type：
-
- Shape：
-
- Length：
-
- Width：
-
- Package Cooled：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
121 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
287
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
287
In-stock
|
|||
|
|
DFRobot | RASPBERRY PI PUR... |
132
In-stock
|
|||
|
|
t-Global Technology | PH3N NANO 50.8X12.07X... |
129
In-stock
|
|||
|
|
Aavid | TOP MOUNT HEATSI... |
622
In-stock
|
|||
|
|
Aavid | COPPER HEATSINK ... |
108
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | QUADFLOW HEATSIN... |
24
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | DUALFLOW HEATSIN... |
24
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | QUADFLOW HEATSIN... |
25
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | DUALFLOW HEATSIN... |
25
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | CPU HEAT SINK NO ... |
25
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | CPU HEAT SINK NO ... |
25
In-stock
|
|||
|
|
Aavid | INTEL XEON CPU CO... |
18
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TRIPLE ... |
1,349
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CO... |
1,408
In-stock
|
|||
|
|
Aavid | THM,10594B-TT REV BB... |
1,806
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
2,358
In-stock
|
|||
|
|
Seeed | RASPERRY PI COPP... |
199
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CO... |
4
In-stock
|
|||
|
|
t-Global Technology | PH3 76.2X25.4X0.21MM |
5
In-stock
|