- Manufacturer：
-
- Aavid (28)
- CUI Devices (12)
- Panasonic (1)
- Seeed (1)
- t-Global Technology (11)
- Wakefield-Vette (1)
- Part Status：
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- Material：
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- Packaging：
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- Type：
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- Shape：
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- Length：
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- Width：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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72 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Molex Corporation | CHIPSET COOLER #2... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
219
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
219
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-252 D-P... |
559
In-stock
|
|||
|
|
Seeed | RASPERRY PI COPP... |
199
In-stock
|
|||
|
|
t-Global Technology | HEATSINK CER 60X60... |
13
In-stock
|
|||
|
|
t-Global Technology | HEATSINK CER 43X43... |
25
In-stock
|
|||
|
|
Aavid | 78030 EXTRUSION 2.36X... |
8
In-stock
|
|||
|
|
Aavid | 78345 EXTRUSION 1.54X... |
6
In-stock
|
|||
|
|
Aavid | 78065 EXTRUSION 1.1X... |
6
In-stock
|
|||
|
|
t-Global Technology | XL25 CERAMIC BOAR... |
2,545
In-stock
|
|||
|
|
t-Global Technology | HEATSINK CER 20X20... |
1,384
In-stock
|
|||
|
|
t-Global Technology | HEATSINK CER 32X32... |
125
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
981
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 4.1W... |
442
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
874
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
994
In-stock
|
|||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
879
In-stock
|