- Manufacturer：
-
- 3M (161)
- Aavid (27)
- Bergquist / Henkel (46)
- CUI Devices (52)
- Laird Thermal Materials (490)
- Leader Tech Inc. (26)
- Panasonic (232)
- Parker Chomerics (14)
- t-Global Technology (509)
- Taica Corporation (34)
- Wakefield-Vette (31)
- Series：
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- Material：
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- Type：
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- Thickness：
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- Usage：
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- Adhesive：
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- Thermal Conductivity：
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- Outline：
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- Backing, Carrier：
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- Thermal Resistivity：
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- Filter：
1,624 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Laird Thermal Materials | TFLEX UT20325 18" X 18... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 100MMX100... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX UT20300 18" X 18... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | THERM PAD 304.8MMX3... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX B2150 18X18IN |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX UT20275 18" X 18... |
5
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX B2130 18X18IN |
1
In-stock
|
|||
|
|
Wakefield-Vette | THERM PAD 152.4MMX1... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 228.6MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 228.6MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX B2110 18X18IN |
5
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX UT21000 9" X 9" |
3
In-stock
|
|||
|
|
CUI Devices | THERM PAD 26.25MMX5... |
5
In-stock
|
|||
|
|
CUI Devices | THERM PAD 20MMX40M... |
4
In-stock
|
|||
|
|
t-Global Technology | SILICONE THERMAL... |
3
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 228.6MMX2... |
5,000
In-stock
|
|||
|
|
3M | THERM PAD 25MMX25M... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERM PAD 30MMX31.2... |
4
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 228.6MMX2... |
5,000
In-stock
|
|||
|
|
3M | THERM PAD 30MMX30M... |
5,000
In-stock
|